品牌 | ADI(亚德诺) | BB | CHIPLON(启珑) | Gcore(扬州国芯) | HGC(深圳汉芯) | HGSEMI(华冠) | HTCSEMI(海天芯) | JRC | MICROCHIP(美国微芯) | Nisshinbo | NTE ELECTRONICS, INC. | Slkor(萨科微) | Sungine(双竞集成) | TI(德州仪器) | XINLUDA(信路达) | |
封装/规格 | DIP-14 | DIP-16 | DIP-20 | DIP-8 | MSOP-8 | PLCC-20(9x9) | SOP-14 | SOP-16 | SOP-20-300mil | SOP-8 | SOT-23-8 | TO-100 | TSSOP-14 | |
工作温度 | -55℃~+125℃ | -25℃~+85℃ | 0℃~+70℃ | |